Manufacturing

Swissflex Microelectronics disposes modern fabrication facilities as well as specialized expertise in the field of nanotechnology.

Swissflex Microelectronics serves as SME partner.

Swissflex Microelectronics will mainly deal with

Step I : Technical Feasibility Study
Step II : Design & Development
Step III : Prototyping
Step IV : Industrialization and Manufacturing

Swissflex Microelectronics has expertise in particular:

1) Proof of Concept, Project Management, Design & Layout (Gerber Files), Design Rules, Multilayer Manufacturing Design, Materials and Prozess, Metalization and all photolithography process for patterning of microcircuits on different substrates.

2) Manufacturing process, Material selection, Photolithography and Thin film metallization and dry and wet etching process

3) Multilayered Production Files Gerber and Modelling.

4) Micro assembly hybrid microcircuits

5) System integration

We know the expectations of your industry and we understand your needs.

We will design and offer you the right solution for your requirements.

If we get involved right from the start and we supply you with a final solution with highly qualified and motivated employees and our engineering tools, we make it much easier for you to finalize your design, your products and your systems.

The main markets are:

Medical devices & electronics technology
Industrial Sensors – Special industrial sensor
Institutes-Universities
Aeronautics & Defence (Aircraft)
Automotive market
Telecommunications (HF-Radar)
Mobile Electronic (wearables)
Engineering Research

History Development of Swissflex Microelectronics

2019

Strategic investment plan for in-line process equipment > 1m2 Substrate Size
Strategic investment in high volume manufacturing equipment capabilities
Strategic investment for double layer R2R manufacturing equipment
EU sales office
Nord America sales office
Canada sales office
ASIA sales office
Russian sales office

2018

Ultra flexible microcircuit (SmartSlimFlex) on 6″ and 8” substrate up to 5 layers manufacturing equipment in 574 m2 area in St-Imier (BE)
Thin and Thick microcircuit (SmartSlimCeram) on 6″ and 8” AlN and AlO3 substrate single, double or multilayer manufacturing
Investment plan and decision for in-line process equipment
Prototype level RTL5-6 : 2 new Medical Products – MEDCAMFLEX Capsule Endoscopy with 6 cameras and MEDUS 4D on phone
Wearable flexible electronics – Shoe and bed mapping sensing and applications for a private company

2017

Thin film microcircuits manufacturing (SmartSlimFlex) on 6″ and 8″ on glass and ceramic substrate
Development of process of HDI Flex – Ultra flexible thin film circuits technology
MEDCAMFLEX Capsule Endoscopy on phone and Long Endoscopy – Research and Development
Multi Chip Module Device MCM-D double layer
MEDUS 4D Ultrasonic Medical Echography on phone – Research and Development
Combined SmartSlimFlex & Hybrids sensors solutions for aeronautics
6” and 8” glass and ceramics substrate (on square and circular substrate carrier)
Wearable flexible electronics – Shoe and bed mapping sensing
Development of process of HDI Flex – Ultra flexible thin film circuits technology
First combined SmartSlimFlex & Hybrids sensors solutions for aeronautics

2016

Microcircuits based liquid polyimide on 6″ and 8” glass panels
Thin and thick microcircuit based on AlN and AlO3 ceramics
Double Side Metallization of ultra flexible microcircuits technology
Ultra flexible microcircuits technology with high density interconnection cables
6” and 8” circular and square substrate based on Silicium, Glass or Ceramics microcircuits
Divers Substrate like PI, ETFE, PET
Foundation of Swissflex Microelectronics Sàrl