What we offer

When you choose Swissflex Microelectronics as your thin film manufacturing partner you get more than a professional design, manufacturing and processing facility at your service, you get to take advantage of the latest innovations in ultra thin film today.

Integration the latest and most advanced multilayer thin film techniques and functions into your ultra thin flexible circuit and component designs.

We know the expectations of your industry and we understand your needs. Contact us and we will develop an individual solution for you.

If we get involved right from the start and we supply you with a final solution with highly qualified and motivated employees and our engineering tools, we make it much easier for you to finalize your design, your products and your systems. We will design and offer you the right solution for your requirements.

  • CAD Design and translation
  • Photomask Layout & Design
  • All substrates
  • Photolithography
  • Photoresist Coat processing
  • Polyimide Coat processing
  • Sputtering thin layer
  • Electroplating
  • Laser vias & Outline cut
Customer CAD Designer

CAD Design and translation

Swissflex Microelectronics works with customer CAD data in DXF, AutoCAD DWG, Gerber, or GDS formats. We redesign, translate and repair customer CAD designs created in the different CAD systems in order to make it usable in manufacturing.

Photomask Layout & Design

Customer supplied CAD designs are plotted into a step & repeat pattern in order to maximize substrate yield and provide the lowest cost and highest quality thin film devices.

All substrates

All substrates following are available.


Photolithography is the process of using light to transfer images from a photomask to a coated thin film substrate. The key to the process is the use of a light-sensitive chemical called photoresist and a precision phototool, called a photomask. The photomask is custom tooling made from customer CAD files.

Photoresist Coat processing

Photoresist coating with enables patterning, is applied to thin film substrates via spin coating.

Polyimide Coat processing

Polyimde coating is applied to thin film substrates via spin coating. Polyimide offers the ability to build up multiple layers of circuitry.

Sputtering thin layer

Custom thin film metallization consists of sputtering metal layers with patterns made to customer specifications.

Swissflex Microelectronics is able to deposit a wide variety of films on many different substrate materials (Silicon, Glass, Alumina, Insulated Metal Substrates like Aluminium and Copper).

We are using 3 targets in-line sputtering systems in order to provide willing film quality and access to custom adhesion, barrier and conductive layers.

The target materials available at Swissflex Microelectronics include Chromium, Titanium, Copper, Gold, Platinum, Aluminum, Tungsten, Tantalum, Silver, and Chromium Nickel alloys.

Depending on the material selected needs, thin film sputtered layers can range from 25 nm for adhesion layers to 9um for conduction layers. Patterning is done to match customer specifications using wet chemical etch processes, dry etch processes, lift-off processes, liquid or dry photoresist processes, fine thin film line patterns and in circuit test measurement.


‘ENIG’ (Electroless Nickel, Immersion Gold) in which a Ni thickness normally 3-5μm layer of electroless nickel is given a thin gold ‘flash’ coating by immersion plating Au thickness 0,05-0,12 μm, an ion exchange process which coats the whole of the nickel surface. It means that ENIG is an electroless nickel layer capped with a thin layer of immersion gold.

ENIG is usually applied selectively on all Copper areas still free after soldermask printing (coated polyimide coverlayer or laminated yellow adhesive coverlayer).

Application of soldermask after ENIG plating processes is possible but not recommended for laminated yellow adhesive coverlayer or coated polyimide as coverlayer, because it reduces the adhesion during etching processes.

Laser microvias & Outline cut

Micro-vias are structures with laser with highly conductive, highly reliable interconnection between sub-multilayers.