Ultra Thin HDI Multilayer Flex

HDI Vias connection on two multilayer ultra thin flex

Position Description MIN [um] NOM [um]
a1, a2 Trace width 10 15
b1,b2 Distance trace to trace 40 45
c1, c2 Interconnect pitch 50 60
Vpx,Vpy Via pads 60 75
d1,d2,d3 Via opening diameter 30 30
e1,e2 Distance trace to via  pad 15 15
UTMF-1

HDI Microvia

microvia
microvia2