Ultra Thin HDI Multilayer Flex
HDI Vias connection on two multilayer ultra thin flex
Position | Description | MIN [um] | NOM [um] |
a1, a2 | Trace width | 10 | 15 |
b1,b2 | Distance trace to trace | 40 | 45 |
c1, c2 | Interconnect pitch | 50 | 60 |
Vpx,Vpy | Via pads | 60 | 75 |
d1,d2,d3 | Via opening diameter | 30 | 30 |
e1,e2 | Distance trace to via pad | 15 | 15 |

HDI Microvia

