Hybrid Microcircuits on Ceramics
Ultra Thin Multilayer Polyimide based on Ceramics
Design Symbol | Design Parameter | Design value [mm] |
A | Line width | 0.03 |
B | Line to Line edge | 0.03 |
C | Via diameter | 0.075 |
D | Via pad diameter | 0.10 |
E | Via to via edge | 0.1 |
F | Via pad to Line edge | 0.1 |
G | Line to contour edge | 0.2 |
H | Via to to contour edge | 0.3 |

