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Hybrid Microcircuits on Ceramics - Swissflex Microelectronics Ultra Thin Flexible Circuits

Hybrid Microcircuits on Ceramics

Ultra Thin Multilayer Polyimide based on Ceramics

Design Symbol Design Parameter Design value [mm]
A Line width 0.03
B Line to Line edge 0.03
C Via diameter 0.075
D Via pad diameter 0.10
E Via to via edge 0.1
F Via pad to Line edge 0.1
G Line to contour edge 0.2
H Via to to contour edge 0.3