Flexible Hybrid Electronics Manufacturing
Custom thin film metallization consists of sputtering metal layers with patterns made to customer specifications.
Swissflex Microelectronics is able to deposit a wide variety of films on many different substrate materials (Silicon, Glass, Alumina, Insulated Metal Substrates like Aluminium and Copper).
We are using 3 targets in-line sputtering systems in order to provide willing film quality and access to custom adhesion, barrier and conductive layers.
The target materials available at Swissflex Microelectronics include Chromium, Titanium, Copper, Gold, Platinum, Aluminum, Tungsten, Tantalum, Silver, and Chromium Nickel alloys.
Depending on the material selected needs, thin film sputtered layers can range from 25 nm for adhesion layers to 9um for conduction layers. Patterning is done to match customer specifications using wet chemical etch processes, dry etch processes, lift-off processes, liquid or dry photoresist processes, fine thin film line patterns and in circuit test measurement.
SPUTTERING
| Metallization for flex circuits | Material | Thickness Range SPUTTERED | Typical Thickness |
| Conductive Layers | Au,
Cu, Ni, Al |
0.1 µm to 1.5 µm
0.1 µm to 1.0 µm 0.1 µm to 1.0 µm 0.1 µm to 1.0 µm |
0.10 µm
0.60 µm 0.02 µm 0.30 µm |
| Diffusion Barrier Layers: | Ni,
Pt, Pd, TiW, Mo, NiCu |
0.05 µm – 0.2 µm
0.05 µm – 0.2 µm 0.07 µm – 0.15µm 0.03 µm – 0.06 µm 0.05 µm – 0.2 µm 0.05 µm – 0.2 µm |
0.02 µm
0.10 µm 0.10 µm 0.05 µm 0.60 µm 0.60 µm |
| Adhesion Layers | Cr,
NiCr, Ti, TiW |
0.02 µm – 0.01 µm
0.02 µm – 0.25 µm 0.02 µm – 0.01 µm 0.02µm – 0.06µm |
0.03 µm
0.05 µm 0.06 µm 0.05 µm |
| Resistive Layers | Ta2N,
NiCr |
0.02 µm – 0.15 µm
0.02 µm – 0.25 µm |
0.05 µm
0.05 µm |
| Substrates | Glass,
Si, AlN, Alumina SOI |
4 inch x 4 inch
6 inch x 6 inch 8 inch x 8 inch
|
ELECTROPLATING
| Metallization for flex circuits | Material | Thickness Range
ELECTROPLATED |
Typical Thickness |
| Conductive Layer | Cu | 1.0-7.0 | 4.0 |
| Diffusion Barrier Layer | Ni | 0.5-7.0 | 1.5 |
| Diffusion Barrier Layer | Pd | 0.5-1.5 | 0.5 |
| Solder Layer | Au | 0.1-2.0 | 1.2 |
| Solder Layer | Sn | 0.5-8.0 | 1.5 |
Adherence test
|
Adherence test
|
Solder Test |
| Pull Test |
