Flexible Hybrid Electronics Manufacturing

Custom thin film metallization consists of sputtering metal layers with patterns made to customer specifications.

Swissflex Microelectronics is able to deposit a wide variety of films on many different substrate materials (Silicon, Glass, Alumina, Insulated Metal Substrates like Aluminium and Copper).

We are using 3 targets in-line sputtering systems in order to provide willing film quality and access to custom adhesion, barrier and conductive layers.

The target materials available at Swissflex Microelectronics include Chromium, Titanium, Copper, Gold, Platinum, Aluminum, Tungsten, Tantalum, Silver, and Chromium Nickel alloys.

Depending on the material selected needs, thin film sputtered layers can range from 25 nm for adhesion layers to 9um for conduction layers. Patterning is done to match customer specifications using wet chemical etch processes, dry etch processes, lift-off processes, liquid or dry photoresist processes, fine thin film line patterns and in circuit test measurement.

SPUTTERING

Metallization for flex circuits Material Thickness Range SPUTTERED Typical Thickness
Conductive Layers Au,

Cu,

Ni,

Al

0.1  µm to 1.5 µm

0.1 µm to 1.0 µm

0.1 µm to 1.0 µm

0.1 µm to 1.0 µm

0.10 µm

0.60 µm

0.02 µm

0.30 µm

Diffusion Barrier Layers: Ni,

Pt,

Pd,

TiW,

Mo,

NiCu

0.05 µm – 0.2 µm

0.05 µm – 0.2 µm

0.07 µm – 0.15µm

0.03 µm – 0.06 µm

0.05 µm – 0.2 µm

0.05 µm – 0.2 µm

0.02 µm

0.10 µm

0.10 µm

0.05 µm

0.60 µm

0.60 µm

Adhesion Layers Cr,

NiCr,

Ti,

TiW

0.02 µm – 0.01 µm

0.02 µm – 0.25 µm

0.02 µm – 0.01 µm

0.02µm – 0.06µm

0.03 µm

0.05 µm

0.06 µm

0.05 µm

Resistive Layers Ta2N,

NiCr

0.02 µm – 0.15 µm

0.02 µm – 0.25 µm

0.05 µm

0.05 µm

Substrates Glass,

Si,

AlN,

Alumina

SOI

4 inch x 4 inch

6 inch x 6 inch

8 inch x 8 inch

 

ELECTROPLATING

Metallization for flex circuits Material Thickness Range

ELECTROPLATED

Typical Thickness
Conductive Layer Cu 1.0-7.0 4.0
Diffusion Barrier Layer Ni 0.5-7.0 1.5
Diffusion Barrier Layer Pd 0.5-1.5 0.5
Solder Layer Au 0.1-2.0 1.2
Solder Layer Sn 0.5-8.0 1.5

Adherence test

 

 

Adherence test

 

 

 

Solder Test

Pull Test